发明名称 |
Cooling housing useful for accommodating electronic components, comprises heat pipes for cooling the electronic components, and are integrated with the cooling housing, and contain a liquid fluid that evaporates under heat absorption |
摘要 |
<p>#CMT# #/CMT# Cooling housing (1) for accommodating electronic components, comprises heat pipes for cooling the electronic components, and are integrated with the cooling housing. The heat pipes contain a liquid fluid (40) that evaporates under heat absorption and condenses under heat output. The heat pipes are formed during the manufacture of the cooling housing by a generative manufacturing method. The respective heat pipes comprise a fluid-impermeable outer wall (28) and a fluid permeable inner wall (30) defining a steam channel (42). #CMT# : #/CMT# An independent claim is also included for manufacturing the cooling housing using generative manufacturing method, comprising forming the heat pipes integrally with the cooling housing. #CMT#USE : #/CMT# The cooling housing is useful for accommodating electronic components. #CMT#ADVANTAGE : #/CMT# The cooling housing: is produced in an easy manner; has a simple structure; comprises heat pipes with improved heat transfer property; and ensures a safe cooling of the electronic components. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a perspective view of an open cooling housing, and a cross section through the cooling housing, respectively. 1 : Cooling housing 28 : Outer wall 30 : Inner wall 40 : Liquid fluid 42 : Steam channel #CMT#INSTRUMENTATION AND TESTING : #/CMT# Preferred Components: A back-projection of a housing wall is formed, oriented in an external environment from a portion of an outer wall of the housing. The heat pipes are thermally connected with an external cooling structure. The cooling structure is located on the back-projection, or the cooling structure is located with at least a portion above the heat pipes, independent of an orientation of the cooling housing. The respective heat pipes have a capillary structure. The adjacent heat pipes are at a distance from each other. At least some heat pipes are combined into a composite heat pipe, and have varying cross-sectional areas. The heat pipes have an uniform filling opening irrespective of their form.</p> |
申请公布号 |
DE102011086786(B3) |
申请公布日期 |
2013.03.28 |
申请号 |
DE20111086786 |
申请日期 |
2011.11.22 |
申请人 |
MTU AERO ENGINES GMBH |
发明人 |
HILLER, SVEN;GEIGER, PETER;BAYER, ERWIN;HES, THOMAS |
分类号 |
H05K7/20;B22F3/105;B23K26/34;B64D33/08;H05K5/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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