发明名称 Hermetic encapsulated organic LED arrangement for use in roof of building to introduce daylight and artificial light, has sealing layer comprising inner recess at inner side, and connected with support substrate by hermetic connection
摘要 <p>#CMT# #/CMT# The arrangement (110) has organic LED (OLED) (112) attached on an outer side and an inner side of a planar support substrate (116). A planar sealing layer (118) i.e. sealing substrate, is provided with an outer side and an inner side. The OLED and a solar cell (114) are encapsulated between the support substrate and the sealing layer. The sealing layer comprises an inner recess at an inner side, and immediately connected with the substrate by a hermetic connection (119) such that a hermetic encapsulation is formed from the support substrate, the sealing layer and the hermetic connection. #CMT# : #/CMT# The solar cell is designed as an organic solar cell such as an organic photovoltaic cell. The hermetic connection is made by a welding process. The support substrate and/or the sealing layer is made of transparent thermoplastic or glasses. #CMT#USE : #/CMT# Hermetic encapsulated OLED arrangement for use in a window, a facade component or a roof of a building or a roof of a vehicle to introduce daylight and an artificial light. #CMT#ADVANTAGE : #/CMT# The sealing layer comprises the inner recess at the inner side, and is immediately connected with the substrate by the hermetic connection such that the hermetic encapsulation is formed from the support substrate, the sealing layer and the hermetic connection, thus improving the sealing of an independently powered OLED arrangement without lines outwards, and achieving better tightness, and hence preventing environmental influences and avoiding damaging of the OLED. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a sectional view of a solar cell and an OLED arranged on opposite sides of an encapsulated OLED arrangement. 110 : Hermetic encapsulated OLED arrangement 112 : OLED 114 : Solar cell 116 : Planar support substrate 118 : Planar sealing layer 119 : Hermetic connection.</p>
申请公布号 DE102011083247(A1) 申请公布日期 2013.03.28
申请号 DE20111083247 申请日期 2011.09.22
申请人 TRILUX GMBH & CO. KG 发明人 GANZER, BERND
分类号 H01L25/16;F21S9/03;H01L23/28;H01L27/30;H01L51/44;H01L51/52 主分类号 H01L25/16
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