Method for connecting electronic part e.g. transistor, involves applying electrical conductive layer for electrically connecting electrical contact surface of electronic part with electrical strip conductor, and applying covering layer

摘要

The method involves curing a liquid layer applied on a substrate (2) for forming an electrical insulating layer (3), and placing an electronic part (1) on the substrate. Another liquid layer is applied on the electrical insulating layer and partially on the electronic part and cured for forming another electrical insulating layer (3'). An electrical conductive layer (5) is applied for electrically connecting an electrical contact surface (9) of the electronic part with an electrical strip conductor (6). A covering layer (7) is applied on the electrical conductive layer. An independent claim is also included for an assembly comprising an electronic part.