A COMPOSITION FOR PREPARING A BONDING MATERIAL AND USES THEREOF
摘要
<p>The present invention discloses a composition for preparing a bonding material for use in a circuit board comprising a polymerizable acrylate system and a curable epoxy resin system, the composition being photocurable. The present invention also provides a circuit board comprising the bonding material.</p>
申请公布号
WO2013043435(A1)
申请公布日期
2013.03.28
申请号
WO2012US54896
申请日期
2012.09.12
申请人
3M INNOVATIVE PROPERTIES COMPANY;LEE, JUSTINA S.;SONG, HYUNG-JIN;OUDERKIRK, ANDREW J.;PLAUT, DAVID J.
发明人
LEE, JUSTINA S.;SONG, HYUNG-JIN;OUDERKIRK, ANDREW J.;PLAUT, DAVID J.
