| 摘要 |
<p>16 Receiving Means for Mounting of WafersAbstractThis invention relates to a receiving means for receiving and mounting of wafers with the following features:- a mounting surface (1o),mounting means for mounting of the wafer on the mounting surface (1o) andcompensation means (3, 4, 5, 6) for active, especially locally controllable, at least partial compensation of local and/or global distortions of the wafer.Furthermore this invention relates to a device and a method for alignment of a first wafer with a second wafer using an aforementioned receiving means.Figure 3b</p> |
