| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide alternative techniques for treatment of substrates, particularly for removing materials, especially organic materials, and most especially photoresist materials from substrates such as semiconductor wafers. <P>SOLUTION: A method for treatment of substrates comprises a) placing a substrate having material on a surface thereof in a treatment chamber; b) directing a stream of a liquid treatment composition to impinge the substrate surface; and c) directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
