发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CHIP STACKING AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting an integrated circuit structure on the first substrate; mounting a second substrate on the integrated circuit structure; coupling a vertical chip to the first substrate and to the second substrate; and forming a package body for encapsulating the integrated circuit structure, the vertical chip, and a portion of the second substrate.
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申请公布号 |
US2013075915(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201113243474 |
申请日期 |
2011.09.23 |
申请人 |
KIM DAESUP;KIM YOUNGJOON;CHOI DAESIK |
发明人 |
KIM DAESUP;KIM YOUNGJOON;CHOI DAESIK |
分类号 |
H01L23/48;H01L21/50;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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