发明名称 |
Semiconductor Chips and Semiconductor Packages and Methods of Fabricating the Same |
摘要 |
A semiconductor device includes a substrate and a through via penetrating the substrate. The through via has a protruding portion at a first end thereof extending out from a first surface of the substrate and a second end of the via contacting an interconnection line proximate a second, opposite, end of the substrate. A wetting layer is positioned between the via and the substrate and extends over the protruding portion of the via. The wetting layer includes a material selected to improve an adhesive strength between the wetting layer and a solder ball contacting the wetting layer extending over the protruding portion of the via when a solder ball is coupled to the wetting layer.
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申请公布号 |
US2013075905(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201213602581 |
申请日期 |
2012.09.04 |
申请人 |
CHOI JU-IL;PARK JEONG-WOO;JIN JEONGGI;KIM HYUNGSEOK;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI JU-IL;PARK JEONG-WOO;JIN JEONGGI;KIM HYUNGSEOK |
分类号 |
H01L23/48;H01L23/532 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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