| 摘要 |
The invention relates to a device for coating an inner circular surface (7i) of a coating surface (3b) of a carrier wafer (3) with a coating material (9), having the following features: - an applying means (5) for applying the coating material (9), which is provided for coating the inner circular surface (7i), onto the inner circular surface (7i), and - a rotating means (2, 6) for receiving and rotating the carrier wafer (3) about a rotational axis (R) and for distributing the coating material on the coating surface (3b). The invention is characterized in that the second applying means (4) is provided for supplying an outer circular ring surface (7a), which surrounds the inner circular surface (7i), with a coating-blocking agent which at least blocks the outer circular ring surface (7a) from being coated when the coating material (9) is being distributed. The invention also relates to a corresponding method. |
