发明名称 |
COOLING MODULE FOR COOLING ELECTRONIC COMPONENTS |
摘要 |
A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier. |
申请公布号 |
US2013077245(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201213432595 |
申请日期 |
2012.03.28 |
申请人 |
GRADINGER THOMAS;YESIN BERK;AGOSTINI FRANCESCO;ABB RESEARCH LTD |
发明人 |
GRADINGER THOMAS;YESIN BERK;AGOSTINI FRANCESCO |
分类号 |
H05K7/20;F28F1/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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