| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve noise resistance of a semiconductor device obtained by vertically stacking a microphone chip and a circuit element. <P>SOLUTION: A package is formed by vertically overlapping a cover 44 and a substrate 45 with each other. A microphone chip 42 is mounted on the top surface of a recessed part 46 provided to the cover 44. A circuit element 43 is mounted on an upper surface of the substrate 45. The microphone chip 42 is connected to a pad 48 provided to a lower surface of the cover by a bonding wire 50. The circuit element 43 is connected to a pad provided to an upper surface of the substrate by the bonding wire. A cover side bonding part 49 conductive to the pad 48 of the lower surface of the cover and a substrate side bonding part 69 conductive to the pad of the upper surface of the substrate are bonded by a conductive material 86. In the vicinity of the bonding pad 48 and the cover side bonding part 49, a conductive layer 55 for electromagnetic shielding is buried in the cover 44. <P>COPYRIGHT: (C)2013,JPO&INPIT |
