| 摘要 |
There is provided a highly heat-resistant adhesive composition that easily dissolves in various organic solvents, has excellent coating properties, and can form a thick-enoughadhesive layer and that undergoes little thermogravimetric loss during high-temperatureprocesses such as steps of metal bump bonding, CVD, an.d ion diffusion and achieves excellent bonding. An adhesive composition comprising a polymer that contains a unit structure of Formula (1):[err]Formula (1)(where L1 is an arylene group or a combination of an arylene group and a sulfonyl group or a carbonyl group, and T1 is a fluoroalkylene group, a cyclic alkylene group, an arylenegroup having a substituent, or a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cyclic alkylene group) and contains, at a terminal or in a side chain or the main chain, at least one group containing a structure ofFormula (2-A), a structure of Formula (2-B), or both structures:[err]Formula (2-A)[err]Formula (2-B)NO SUITABLE FIG. |
