发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 A semiconductor device includes a first device isolation insulating film defining a first region, a first conductive layer of a first conductivity type formed in the first region, a semiconductor layer formed above the semiconductor substrate and including a second conductive layer of the first conductivity type connected to the first conductive layer and a third conductive layer of the first conductivity type connected to the first conductive layer, a second device isolation insulating film formed in the semiconductor layer and isolating the second conductive layer and the third conductive layer from each other, a gate insulating film formed above the second conductive layer, and a gate electrode formed above the gate insulating film and electrically connected to the first conductive layer via the third conductive layer.
申请公布号 US2013075743(A1) 申请公布日期 2013.03.28
申请号 US201213627183 申请日期 2012.09.26
申请人 FUJITSU SEMICONDUCTOR LIMITED;FUJITSU SEMICONDUCTOR LIMITED 发明人 YOSHIDA EIJI
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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