发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SHIELD AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.
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申请公布号 |
US2013075889(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201113244273 |
申请日期 |
2011.09.23 |
申请人 |
DO BYUNG TAI;CHUA LINDA PEI EE |
发明人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;CHUA LINDA PEI EE |
分类号 |
H01L23/34;H01L21/56 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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