| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a characteristic test device for semiconductor elements formed by sealing a semiconductor chip with resin, capable of reducing a test cost by simultaneously performing an insulation tolerance test of a resin seal part 15 with another characteristic test and reducing an occupation area of the entire characteristic test device, and to provide a method for testing characteristics of semiconductor elements using the device. <P>SOLUTION: A voltage application jig 1 for testing insulation resistance is brought into contact with the resin seal part 15 of a semiconductor element, and a high voltage that is applied in a static characteristic test or a dynamic characteristic test is applied to the voltage application jig 1 to simultaneously perform an insulation resistance test of the resin seal part 15 with a characteristic test (a leak current test, a voltage endurance characteristic test, an L loading test or the like). <P>COPYRIGHT: (C)2013,JPO&INPIT |
