| 摘要 |
There are provided a crack determining device capable of determining, in real time and with precision, the fact that a crack has occurred in a solder layer, and a semiconductor device comprising same. A crack determining device of the present invention is a crack determining device that determines whether or not a crack has occurred in a solder layer with respect to a semiconductor device in which at least a semiconductor element is connected to a connectee member via the solder layer, the crack determining device comprising a generation part that generates a magnetic field and that is fixed to a member forming the semiconductor device, and a detection part that detects a magnitude of a magnetic field and that is disposed within the solder layer, wherein the magnetic field generated at the generation part is detected at the detection part, and it is determined that a crack has occurred in the solder layer if this magnitude of the magnetic field varies from a magnitude of the magnetic field detected before the crack occurred.
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