| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in which: when an attempt is made to acquire a thick conductive pattern for high current and a thin conductive pattern for low current on a substrate, steps become complicated to cause a cost increase; but when an attempt is made to use the thick conductive pattern for high current as the thin conductive pattern for low current, a fine pattern cannot be drawn on the substrate only by thick film thickness. <P>SOLUTION: A mounting substrate comprises: a core layer 52 composed of an insulating resin; a first conductive pattern 53 provided on a surface side of the core layer 52; a second thick conductive pattern 73 provided on a rear side of the core layer 52; and a Via 72 provided between a first electrode for high current in the first conductive pattern 53 and a second conductive pattern 301 provided so as to correspond to the first electrode. A resistance value of the Via 72 is lowered so that high current flows in the electrode on the rear side of the core layer via the Via 72. In addition, a signal can be taken out on the surface side because it can be relocated by a thick wiring 301 on the rear side. <P>COPYRIGHT: (C)2013,JPO&INPIT |
