LAMINATED BODY, LAMINATED BOARD, MULTI-LAYER LAMINATED BOARD, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR LAMINATED BOARD

摘要

A laminated body including at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition including a heat-curable resin and an inorganic filler. A laminated board including at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition including a heat-curable resin and an inorganic filler. A printed wiring board having the laminated board, and wiring provided on the surface of the laminated board. A production method for a laminated board, said laminated board including: at least one cured resin layer comprising a cured product of a resin composition including a heat-curable resin and an inorganic filler; and at least one glass substrate layer. The production method for the laminated board includes a cured resin layer-forming step in which the cured resin layer is formed on the surface of the glass substrate.