| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively suppress scattering of solder balls to the circumference of a soldering object upon dip soldering due to explosive scattering of a gas aggregate, such as flux, by reducing the generation of the gas aggregate when dipping a soldering portion with flux applied thereto into a soldering bath. <P>SOLUTION: A soldering device 21 includes the solder tank 23 and an electric field application device 25. The device 25 for applying an electric field into the soldering bath 27 includes: a positive voltage application electrode 25a to which positive voltage is applied as a field generation source; a negative voltage application electrode 25 applying negative voltage; and a power source 25c for applying voltage between both terminals 25a, 25b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
