| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pickup method for a semiconductor chip capable of suppressing breakage of the semiconductor chip and an occurrence of pickup mistakes of the semiconductor chip when picking up the semiconductor chip from a dicing tape. <P>SOLUTION: A dicing tape having a sacrificial adhesive layer evaporated by specific processing, and a tape main body are prepared. The tape main body is adhered via the sacrificial adhesive layer onto a surface located on an opposite side to the surface where a first bump electrode is formed among surfaces of a mother board for semiconductor chip formation. Next, by cutting the mother board for semiconductor chip formation and the sacrificial adhesive layer off along a dicing region from a side where the first bump electrode is formed, the semiconductor chip and the sacrificial adhesive layer are individualized. Next, the surface where the first bump electrode is formed, of the semiconductor chip to be picked up among the individualized semiconductor chips is sucked and held, and the sacrificial adhesive layer formed to the sucked and held semiconductor chip is evaporated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
