ADHESIVE COMPOSITION, USE THEREOF, CONNECTION STRUCTURE FOR CIRCUIT MEMBERS, AND METHOD FOR PRODUCING SAME

摘要

An adhesive composition for connection between a first circuit member having a first connecting terminal on the main surface and a second circuit member having a second connecting terminal on the main surface, wherein the first circuit member and/or second circuit member are made of a base material containing a thermoplastic resin with a glass transition temperature of no higher than 200° C., the first connecting terminal and/or second connecting terminal are made of ITO and/or IZO, and the adhesive composition includes a phosphate group-containing compound, the free phosphate concentration of the cured adhesive composition being no greater than 100 ppm by mass.