| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress deterioration of image quality. <P>SOLUTION: A sensor chip comprises a semiconductor substrate on which a plurality of PDs are disposed. A signal processing chip is laminated on the sensor chip and includes a semiconductor substrate on which a logic circuit for driving the sensor chip is formed. A wiring layer including wiring for transmitting/receiving a signal is disposed between the semiconductor substrate of the sensor chip and the semiconductor substrate of the signal processing chip. A light shielding film having light shielding properties is disposed in that region of the wiring layer in which the wiring is not formed. This technique is applicable, for example, to a back irradiation type CMOS solid-state imaging device. <P>COPYRIGHT: (C)2013,JPO&INPIT |
