| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an environment-conscious multilayer printed wiring board capable of forming a via conductor with high connection reliability by removing resin residue in a small diameter aperture for a via. <P>SOLUTION: When performing atmospheric pressure plasma processing with high electron density by using a process gas mixed with a fluorovinyl ether-based gas having a double bond between two carbons and a fluoroalkyl ether group, F radicals, CF radicals, CF2 radicals and CF3 radicals for removing resin residue on the bottom of an aperture for a via conductor by chemical reaction are obtained abundantly with a low mixing ratio. Consequently, chemical removal progresses efficiently and the resin residue of via is removed by a synergetic effect with physical removal by particles in plasma. <P>COPYRIGHT: (C)2013,JPO&INPIT |
