CONNECTION METHOD AND CONNECTION STRUCTURE OF ELECTRONIC COMPONENT

摘要

A connection method and a connection structure of electronic components by which high connection reliability can be obtained. An anisotropic conductive film is temporarily disposed, and thermally compressed and bonded, in such manner that a boundary of a circuit protection area and a terminal area of a second electronic component is positioned on a single layer area of the anisotropic conductive film; and the terminal area of the second electronic component is positioned on a double-layer area of the anisotropic conductive film.