CURABLE COMPOSITION

摘要

The present application relates to a curable composition, to a light-emitting diode (LED), to a liquid crystal display device, and to a lighting device. According to the present application, a curable composition which may exhibit excellent processability and workability and superior crack resistance, hardness, heat resistance, thermal shock resistance, transparency, and adhesion after being cured can be provided. After being applied, the composition is free of cloudiness and is prevented from sticking to a surface. The composition can be valuably used as a bonding material or an encapsulating material for optical semiconductor devices such as an LED, a charge-coupled device (CCD), a photocoupler, etc.