| 摘要 |
An electronic device having a heat generating element and a housing is provided including a heat dissipation arrangement provided between the heat generating element and the housing, the heat dissipation arrangement comprising a first layer in contact with the heat generating element and a second layer provided on top of the first layer and being in contact with the housing, the first layer having higher heat conductivity than the second layer, the second layer preventing heat from rapidly passing through such that the heat can be diffused in the first layer.
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