| 摘要 |
A mounting system for applying an RFID chip module having at least one electrical connection to a substrate having at least one conductor, in particular a label, has the following features: a) a stamping device for stamping out the RFID chip module from a carrier strip having a plurality of chip modules, wherein the stamping device comprises a stamping die having a stamping opening, by which an RFID chip module to be stamped out is received with accurate positioning, and a stamping punch disposed above the stamping opening, and wherein a support for receiving a substrate with accurate positioning is disposed below the stamping opening and the stamping punch can be moved up against the substrate; b) a suction device for holding the RFID chip module on the stamping punch; and c) a heating device for melting solder present on the RFID chip module in order to establish a conductive connection between an electrical connection of the RFID chip module and a conductor of the substrate.
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