发明名称 LAMINATED BODY, LAMINATED BOARD, MULTI-LAYER LAMINATED BOARD, PRINTED WIRING BOARD, AND PRODUCTION METHOD FOR LAMINATED BOARD
摘要 <p>A laminated body including at least two glass substrate layers and at least one interior resin composition layer existing between two adjacent glass substrate layers, wherein the interior resin composition layer comprises an interior resin composition including a heat-curable resin and an inorganic filler. A laminated board including at least two glass substrate layers and at least one interior cured resin layer existing between two adjacent glass substrate layers, wherein the interior cured resin layer comprises a cured product of an interior resin composition including a heat-curable resin and an inorganic filler. A printed wiring board having the laminated board, and wiring provided on the surface of the laminated board. A production method for the laminated board, including a cured resin layer-forming step in which the cured resin layer is formed on the surface of the glass substrate.</p>
申请公布号 WO2013042750(A1) 申请公布日期 2013.03.28
申请号 WO2012JP74118 申请日期 2012.09.20
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 AOSHIMA, MASAHIRO;TAKAHASHI, YOSHIHIRO;YAMAZAKI, YUKA;KAMIGATA, YASUO;MURAI, HIKARI
分类号 B32B17/10;B32B27/20;H05K1/03;H05K3/46 主分类号 B32B17/10
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