| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a breaking device that allows alignment from a reflective film surface side of a wafer to the wafer on which a reflective film is formed. <P>SOLUTION: In a breaking device 1 that adds flexural stress to a divisional schedule line L of a wafer W and breaks the wafer W by contacting a blade 43, imaging means 30 is arranged in a space 16 formed between a pair of supporting rails 21 vertically arranged in parallel near the center of the top surface of a device base 10. The imaging means 30 includes an IR camera 31 imaging the divisional schedule line L and a calculating unit 33 calculating the amount of deviation between the X direction and the rotative direction on the basis of an image by the IR camera 31. Since the IR camera 31 can image the divisional schedule line L from a reflective film 4 side of the wafer W on which the reflective film 4 is formed, the alignment for aligning the position of the divisional schedule line L with the position of the blade 43 can be performed, thereby easily dividing the wafer W and improving the yield of semiconductor chips. <P>COPYRIGHT: (C)2013,JPO&INPIT |
