发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a laminate thereof being excellent in sensitivity, storage stability after lamination onto a substrate, and hue stability. <P>SOLUTION: A photosensitive resin composition includes (A) 10-90 mass% of alkali-soluble polymer, (B) 5-70 mass% of compound having ethylenically unsaturated double bond, (C) 0.01-20 mass% of photopolymerization initiator, and (D) 0.01-10 mass% of colorant. The acid equivalent of (A) alkali-soluble polymer is 100-600 and weight average molecular weight thereof is 5,000-500,000. The (C) photopolymerization initiator contains hexaarylbiimidazole compound and N-aryl-&alpha;-amino acid-compound, and the (D) colorant contains anthraquinone compound with specified structure. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013057902(A) 申请公布日期 2013.03.28
申请号 JP20110197488 申请日期 2011.09.09
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 MATSUDA TAKAYUKI
分类号 G03F7/004;G03F7/031;H05K3/00 主分类号 G03F7/004
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