| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly join a substrate to be processed and a support substrate to each other by suppressing an adhesive protruding from between the substrate to be processed and the support substrate. <P>SOLUTION: An adhesive is applied onto a wafer to be processed (step A1). Then, a solvent of the adhesive is supplied to the outer end of an outer peripheral part of the wafer to be processed (step A2). Then, the solvent of the adhesive is supplied to the inner end of the outer peripheral part of the wafer to be processed (step A3). Then, the solvent of the adhesive is supplied to the outer peripheral part of the wafer to be processed on the outer side than the inner end and at a position where the adhesive remains (step A4). Then, the wafer to be processed is heated to a predetermined temperature to solidify the adhesive on the wafer to be processed (step A5). Then, while heating the wafer to be processed and a support wafer to the predetermined temperature via the adhesive, the wafer to be processed and the support wafer are pressed to be joined to each other (step A14). <P>COPYRIGHT: (C)2013,JPO&INPIT |
