A METHOD, SYSTEM FOR MANUFACTURING A CIRCUIT BOARD, AND THE CIRCUIT BOARD THEREOF

摘要

The present invention provides a method and a system for manufacturing a circuit board for use during fabrication of LEDs. The method includes individual processes (in no particular order) like continuous contacting of various layers of the circuit board, B-staging of an adhesive used in the circuit board, pre-heating of the various layers when the various layers are arranged in an adjacent manner to each other, applying pressure to the circuit board when the various layers are arranged in an adjacent manner to each other, thermal curing of the adhesive and singulating the circuit board.