发明名称 METHOD FOR PROCESSING PLATE-LIKE OBJECT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for processing a plate-like object in which a crack extending from an end of a modified layer formed in the inside of the plate-like object to a front face of the object reaches a center portion of a scheduled division line. <P>SOLUTION: A method for dividing a plate-like object 10 along a scheduled division line 13 formed on a front face of the object, includes the steps of: before forming a modified layer along the division line in the inside of the plate-like object by a laser beam of which condensing point is provided in the inside from a back face side 11b of the plate-like object, positioning the condensing point in the inside close to a back face from the back face side at any detecting position in parallel to the scheduled division line and emitting a laser beam to form a detecting modified layer in the inside of the plate-like object and form a detecting crack extending from the detecting modified layer to the back face; and detecting an angle &alpha; between the detecting crack and a line perpendicular to the back face of the plate-like object. In the method, when H is a distance from an end of the modified layer on the front face side to the front face, a deviation amount &Delta;y from the crack extending from the modified layer to the front face is obtained according to H&times;tan&alpha;, and the modified layer is formed so as to be shifted by the deviation amount &Delta;y. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013058534(A) 申请公布日期 2013.03.28
申请号 JP20110194824 申请日期 2011.09.07
申请人 DISCO ABRASIVE SYST LTD 发明人 TANAKA KEI
分类号 H01L21/301 主分类号 H01L21/301
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