DEPLATING CONTACTS IN AN ELECTROCHEMICAL PLATING APPARATUS

摘要

An electroplating apparatus having improved contact deplating features includes a bowl assembly (26) having a bowl (30) for holding an electroplating solution. A head (22) having a rotor (34) including a contact ring (40) and a head motor (36) for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator (24) may be used to move the head to position a sector of the contact ring in a ring slot (54) or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.