| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device that can easily peel a reinforcing sheet stuck to a substrate and easily cope with change of n object to be peeled. <P>SOLUTION: The method for manufacturing the electronic device includes: a first stage of forming a member for an electronic device on the substrate reinforced by the reinforcing sheet; and a second stage of peeling the reinforcing sheet from the substrate on which the member for the electronic device has been formed. The second stage includes a step of supporting one principal plane of a layered body including the substrate and the reinforcing sheet by a supporting unit, and also controlling the positions of a plurality of rods by a control device such that the other principal plane of the layered body is bent and deformed successively from one end side. In this step, each pad is turned centering the vicinity of an intersection of a centerline of the rod coupled with the pad through a coupling with the substrate-side surface of the reinforcing sheet or the reinforcing-sheet-side surface of the substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
