METHOD OF MANUFACTURING ELECTRONIC DEVICES ON BOTH SIDES OF A CARRIER SUBSTRATE AND ELECTRONIC DEVICES THEREOF
摘要
Some embodiments include a method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof. Other embodiments of related methods and structures are also disclosed.
申请公布号
US2013075739(A1)
申请公布日期
2013.03.28
申请号
US201213684150
申请日期
2012.11.21
申请人
ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF TH;ARIZONA STATE UNIVERSITY;ARIZONA BOARD OF REGENTS, A BODY CORPORATE OF THESTATE OF ARIZONA ACTING FOR AND ON BEHALF OF
