发明名称 Metal Pad Structures in Dies
摘要 A die includes a substrate, a metal pad over the substrate, and a passivation layer that has a portion over the metal pad. A dummy pattern is disposed adjacent to the metal pad. The dummy pattern is level with, and is formed of a same material as, the metal pad. The dummy pattern forms at least a partial ring surrounding at least a third of the metal pad.
申请公布号 US2013075872(A1) 申请公布日期 2013.03.28
申请号 US201113247616 申请日期 2011.09.28
申请人 CHUANG YAO-CHUN;CHUANG CHITA;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHUANG YAO-CHUN;CHUANG CHITA;KUO CHEN-CHENG;CHEN CHEN-SHIEN
分类号 H01L23/58 主分类号 H01L23/58
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