发明名称 ADHESIVE COMPOSITION, ADHESIVE FILM, ADHESIVE SHEET, CIRCUITRY CONNECTOR, METHOD FOR CONNECTING CIRCUITRY MEMBER, USE OF ADHESIVE COMPOSITION, USE OF ADHESIVE FILM, AND USE OF ADHESIVE SHEET
摘要 <p>An adhesive composition for adhering together a first circuit member where a first circuit electrode is formed atop the primary surface of a first circuit board and a second circuit member where a second circuit electrode is formed atop the primary surface of a second circuit board, so that the first circuit electrode and the second circuit electrode are electrically connected together, wherein the first circuit board and/or the second circuit board is/are a substrate including a thermoplastic resin having a glass transition temperature of 200°C or lower, and contain(s) core/shell silicone particles including a core layer and a shell layer provided so as to cover the core layer.</p>
申请公布号 WO2013042724(A1) 申请公布日期 2013.03.28
申请号 WO2012JP74051 申请日期 2012.09.20
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 IZAWA HIROYUKI;ARIFUKU MOTOHIRO;KATOGI SHIGEKI;YOKOTA HIROSHI;YAMAMURA TAIZOU
分类号 C09J201/00;C09J4/00;C09J7/00;C09J7/02;C09J9/02;C09J11/04;C09J11/08;H01B1/20;H01L21/60;H05K1/14 主分类号 C09J201/00
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