发明名称 |
ETCHING SOLUTION FOR COPPER OR COPPER ALLOY |
摘要 |
A solution for selectively etching copper or a copper alloy from a microelectronic device, wherein the device simultaneously includes copper or a copper alloy and nickel-containing material, the solution being an etching solution for copper or a copper alloy comprising a chelating agent having an acid group in a molecule, hydrogen peroxide, and a surfactant having an oxyethylene chain in a molecule. |
申请公布号 |
SG187857(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
SG20130011358 |
申请日期 |
2011.08.16 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
YOSHIDA, YUTAKA;KOJI, YUKICHI |
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