METAL FILLING DEVICE

摘要

This metal filling device (1) is a device that fills a molten metal (M) into a minute space formed at the surface of a semiconductor wafer (K). The metal filling device (1) is provided with: a processing unit body (2) provided with a processing chamber (5) at which the semiconductor wafer (K) is held; a molten metal supply mechanism (10); and a molten metal recovery mechanism (20). The molten metal supply mechanism (10) includes: a supply tank (11) that retains the molten metal (M); a supply tube (13) connected to the supply tank (11) and the processing chamber (5) of the processing unit body (11); and a supplier (12) that is interposed in the supply tube (13) and supplies the molten metal (M) within the supply tank (11) into the processing chamber (5) via the supply tube (13). The molten metal recovery mechanism (20) recovers from within the processing chamber (5) the molten metal (M) supplied into the processing chamber (5).