发明名称
摘要 <P>PROBLEM TO BE SOLVED: To make a metal bump structure conveniently by plating by utilizing a bundle of carbon nanotubes in the mold (framework) of bump structure. Ž<P>SOLUTION: A complex structure consists of an aggregate of carbon-based fibers composed of a plurality of carbon-based fibers and a metal wherein the aggregate of carbon-based fibers is covered with the metal. The clearance between the adjoining aggregates of carbon-based fibers is filled with that metal. The aggregate of carbon-based fibers has a hollow portion internally in the length direction and the hollow portion is filled with that metal. Ž<P>COPYRIGHT: (C)2009,JPO&INPIT Ž
申请公布号 JP5168984(B2) 申请公布日期 2013.03.27
申请号 JP20070093538 申请日期 2007.03.30
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址