| 摘要 |
Disclosed is a semiconductor device wherein the adhesion of resin to a substrate is improved at a low cost. A semiconductor element (11) and one or two substrates (12, 13) opposing one or both of the surfaces of the semiconductor element (11) are sealed by a resin (10), a resin bonding coat (18) which is formed by spraying a metal powder by a cold spray method is formed on one or both of the substrates (12, 13), and recess portions (181) which are widened from a film surface in a depth direction are formed on the resin bonding coat (18). |
