A HEAT SLUGE HAVING TAPE IMPROVEMENTED SEMICONDUCTOR PACKAGES OF ADHESION

摘要

PURPOSE: A heat slug with a tape for improving adhesion with a semiconductor package is provided to enable a user to accurately fix the heat slug on a semiconductor package by accurately attaching an adhesive tape. CONSTITUTION: A semiconductor package(10) includes a semiconductor chip inside. A heat slug(20) closely adheres to the upper side of the semiconductor package and discharges heat from the semiconductor chip. The heat slug is composed of a slug body(21) and a slug adhesive part(22). A slug adhesive tape(30) is formed between the semiconductor package and the slug adhesive part of the heat slug. The slug adhesive part attaches the inner circumference of the semiconductor package to the slug adhesive part.