| 摘要 |
<p>This method for inspecting discriminates defective goods/non-defective goods from among a series of polycrystalline silicon wafer groups, which are obtained by slicing a polycrystalline silicon block, on the basis of baseline physical property values for discriminating defective goods/non-defective goods among polycrystalline silicon wafers. The method for inspecting polycrystalline silicon wafers relatively compares physical property values corresponding to the baseline physical property values that one polycrystalline silicon wafer has to physical property values corresponding to the baseline physical property values that the polycrystalline silicon wafer adjacent during slicing to the polycrystalline silicon wafer has, and discriminates defective goods/non-defective goods among polycrystalline silicon wafers on the basis of the trend of each physical property value that each polycrystalline silicon wafer of the series of polycrystalline silicon wafer groups has.</p> |
