| 摘要 |
PURPOSE: A light-emitting module and a backlight unit are provided to increase reliability of a light-emitting module by disposing a thicker metal layer in a region mounting a light-emitting diode than the other regions. CONSTITUTION: A metal layer(131) includes a second heat dissipation unit(32-2) disposed below a first heat dissipation unit(32-1). A module substrate(32) includes a wiring layer(133) disposed on an insulating layer(132). A plurality of light-emitting diodes are disposed in the wiring layer of the module substrate. The first heat dissipation unit includes thickness thicker than that of the second heat dissipation unit. The first heat dissipation unit includes width narrower than that of the second heat dissipation unit. |
