SPUTTERING TARGET TA SHEET AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A Ta(tantalum) sheet for a sputtering target and a manufacturing method thereof are provided to improve purity because the size of final grains of the Ta sheet is below 35 micrometers and is composed of a structure in which orientation is priority. CONSTITUTION: A Ta sheet manufacturing method includes the following steps: Melted and casted Ta ingots or billets are cold-forged and cold-rolled in order and are annealed at 1173-1573K in order to make the mean diameter of the grains to below 35 micrometers. The cold-forging step includes the following steps: A forging process is implemented by applying a plastic working rate of 40-60%. An intermediate forging process is implemented at below the recrystalization temperature of Ta in order to improve processability.