A HEAT SLUGE IMPROVEMENTED SEMICONDUCTOR PACKAGES OF RADIATION

摘要

PURPOSE: A heat slug for improving a heat radiation effect of a semiconductor package is provided to improve the heat radiation effect by forming an uneven part in a slug body on the upper side of the heat slug. CONSTITUTION: A semiconductor chip is embedded in a semiconductor package(10). A heat slug(20) closely adheres to an inner circumference of the upper side of the semiconductor package and receives a semiconductor chip to discharge heat from the semiconductor chip. The heat slug is composed of a slug body and a slug adhesive part. An uneven part is formed on the upper side of the slug body of the heat slug and discharges the heat from the semiconductor chip to the outside.