<p>A micromaching process to fabricate a single chip that simply drops into a supporting structure. The micromaching process provides the ability to create a probe that will interface with integrated circuits, for example, operating at frequencies in the range of about 100GHz to about 3,000 GHz (3 THz). This approach creates a silicon structure (or other applicable choice of material) that provides mechanical force for probing while supporting the transfer of the high frequency energy between a measurement system and the integrated circuit, individual device or material.</p>
申请公布号
EP2572207(A2)
申请公布日期
2013.03.27
申请号
EP20110818499
申请日期
2011.05.20
申请人
UNIVERSITY OF VIRGINIA PATENT FOUNDATION
发明人
WEIKLE, II, ROBERT M.;LICHTENBERGER, ARTHUR WESTON;BARKER, NICOLAS SCOTT;RECK, THEODORE JAMES;XU, HAIYONG;CHEN, LIHAN