发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a power module which is reducible in plane area. <P>SOLUTION: An IPM 1 includes a U-phase output portion 2, a V-phase output portion 3, a W-phase output portion 4, a gate drive portion 5, a substrate 6, a heat dissipation plate 7, a case 8, and a plurality Al wires 9. The U-phase output portion 2 has a high-voltage portion 11 supplied with electric power having a plus voltage from a P-side power supply portion 61 and a low-voltage portion 12 supplied with electric power having a minus voltage from an N-side power supply portion 62. The high-voltage portion 11 has an Al wiring line 21, an insulating film 22, a switching element 23, and a rectifying element 24. A source electrode 45 of the switching element 23 and an anode electrode 53 of the rectifying element 24 are bonded together through a bonding material 25. Namely, the switching element 23 and rectifying element 24 are stacked. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5171199(B2) 申请公布日期 2013.03.27
申请号 JP20070267787 申请日期 2007.10.15
申请人 发明人
分类号 H01L25/07;H01L25/18;H02M7/48 主分类号 H01L25/07
代理机构 代理人
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