| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to methods for laser thermal cleavage of crystalline quartz. The method of splitting crystalline quartz under the effect of thermoelastic stress involves selecting the cutting direction relative the crystal-lattice orientation of crystalline quartz, selecting the heating intensity in each cutting direction in proportion to the coefficient of linear thermal expansion by changing the speed of relative displacement of the laser beam and the material and/or changing the power of laser radiation, making a cut on the cutting line, laser heating of the cutting line to temperature not higher than the relaxation temperature of thermoelastic stress, and local cooling of the heating zone as a result of moving heating zones on the treated surface and cooling. The value of the coefficient of thermal conductivity is then determined depending on the cutting direction relative the crystal-lattice orientation of crystalline quartz. Heating intensity is selected in proportion to the coefficient of linear thermal expansion in a direction perpendicular to the splitting plane and inversely proportional to the coefficient of thermal conductivity in a direction perpendicular to the treatment plane.EFFECT: enabling formation of laser-induced cracks with given identical geometric characteristics.1 dwg |
